SMART Photonics and GlobalFoundries Partnered on Optics
The companies announced an integrated silicon and indium phosphide foundry service launching in late 2027.
Updated on Sept. 27, 2026 in Semiconductors
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SMART Photonics and GlobalFoundries have announced an open-access foundry service designed to integrate silicon platforms with indium phosphide photonic integrated circuits. This collaborative effort, now entering general availability in the second half of 2027, aims to support the production of advanced optical transceivers.
Why it matters
The partnership addresses critical scaling challenges currently facing AI data centers by streamlining the production of high-speed optical components. It marks a transition toward more efficient, integrated manufacturing processes for complex photonic systems.
The integration utilizes flip-chip technology to embed lasers and modulators directly into a silicon-based cavity. This process required significant co-engineering to meet precise dimensional fit and optical coupling requirements between the silicon and indium phosphide materials.
The players
SMART Photonics
A foundry provider headquartered in the Netherlands that specializes in indium phosphide photonic integrated circuits.
GlobalFoundries
A semiconductor manufacturer with facilities in the USA, Europe, and Singapore that focuses on specialty silicon technology.
The details
The service employs flip-chip technology, a method for connecting semiconductor die to a substrate, to place lasers and amplifiers within a silicon-based cavity. By co-engineering the interface, the companies addressed specific dimensional tolerances and optical coupling—the transfer of light between components—necessary for high-performance photonic integrated circuits. The process seeks to unify these distinct material platforms into a single production workflow.
Timeline
2012: SMART Photonics was founded.
September 2025 to September 2026: The companies conducted co-engineering and development.
Second-half 2027: General availability is expected for the joint foundry service.
The Tech Race
This partnership positions the companies to compete in the expanding market for integrated silicon photonics, a field currently racing to overcome bandwidth limitations in data centers. It follows a trajectory set by the broader industry shift toward manufacturing pluggable optical transceivers more efficiently.
Industry developers and data center architects will gain access to this integrated foundry service starting in late 2027. The development facilitates the creation of compact, high-speed optical transceivers required to support the data transfer demands of large-scale AI infrastructure.
The takeaway
This collaboration signals a maturation in the photonic manufacturing supply chain needed to keep pace with AI data throughput requirements. Engineers should monitor the 2027 rollout to evaluate how these integrated processes impact component costs compared to legacy discrete designs.
What happens next
General availability for the joint foundry service is expected in the second half of 2027.
Further reading
For more on the current manufacturing landscape, explore the latest developments in Semiconductors.
Source note: This article includes information reported by Semiconductor Today.
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