GlobalFoundries Expanded R&D and Capacity Plans
The chipmaker will scale its Taiwan engineering team and optimize global production to meet demand.
Updated on Sept. 24, 2026 in Semiconductors
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GlobalFoundries has announced a strategy to increase manufacturing capacity across its global sites and triple its research and development staff in Taiwan. The expansion aims to address surging demand for radio frequency and power chips from US-based hyperscalers.
Why it matters
The move reflects the intensified pressure on semiconductor manufacturers to scale production amid the global artificial intelligence boom. By focusing on GaN technology, the company is positioning itself to support the power efficiency requirements of next-generation data centers.
The expansion centers on Gallium Nitride (GaN) technology, featuring specifications of 80V and 650V capabilities. GlobalFoundries utilizes a licensing agreement with Taiwan Semiconductor Manufacturing Co to advance these power-efficient semiconductor designs.
The players
GlobalFoundries
A semiconductor manufacturer headquartered in Malta, New York, that specializes in radio frequency, power, and low-power chip fabrication.
Taiwan Semiconductor Manufacturing Co
The world's largest dedicated independent semiconductor foundry that licenses its proprietary GaN technology to partners.
The details
To accommodate the surge in hyperscaler demand, GlobalFoundries plans to optimize existing production lines across its global manufacturing footprint, including key sites in Singapore. The company is simultaneously expanding its R&D presence in Taiwan, focusing on advanced power semiconductor architectures that leverage GaN—a wide-bandgap semiconductor material that allows for smaller, more efficient power systems than traditional silicon. This work builds on the exit of a local Taiwanese foundry from the GaN market in July 2025.
Timeline
September 23, 2026: GlobalFoundries announced its expansion and hiring plans.
July 2025: A Taiwanese foundry exited the GaN market.
The Tech Race
This capacity increase follows the ongoing trend of hyperscaler semiconductor demand requiring higher density power components. It marks a strategic shift for GlobalFoundries as it attempts to fill the vacuum left by other firms exiting the specialized GaN market.
The expansion will eventually increase the availability of high-efficiency GaN power components used in data center infrastructure and high-performance computing. Users should not expect immediate changes, as the firm is still in the process of scaling its R&D headcount to the 100-engineer target.
The takeaway
GlobalFoundries is attempting to secure a larger share of the power chip market by leveraging its licensing agreement with TSMC. Industry observers should watch for updates regarding the company's progress in hitting its 100-engineer milestone in Taiwan as a proxy for manufacturing readiness.
Further reading
Explore deeper into industry manufacturing trends in our Semiconductors section.
Source note: This article includes information reported by Taipei Times.
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