Openlight Began Sampling 3.2T Silicon Photonic ICs
The new 3.2T DR8 chip aims to improve thermal efficiency for next-generation data center optical interconnects.
Updated on Sept. 22, 2026 in Semiconductors
Openlight has initiated sampling for its 3.2T DR8 silicon photonic integrated circuits. The development introduces a higher-capacity platform for data center connectivity currently in the sampling phase.
Why it matters
These components offer a path toward more efficient high-speed networking by reducing thermal load in dense optical packaging. The design prioritizes simplified assembly requirements while maintaining high coupling efficiency.
The PIC achieves 90% coupling efficiency and maintains power dissipation below 2W at 80°C, utilizing integrated 1310nm distributed feedback lasers. The associated 448G InP-based EA modulator demonstrates a 3dB bandwidth nearing 100GHz with a 3.5dB extinction ratio at 2.0V differential.
The players
Openlight
A developer of silicon photonics platforms that integrate lasers and active optical components into CMOS-compatible foundry processes.
Tower Semiconductor
A specialty foundry providing the PH18DA manufacturing process for silicon photonic integrated circuits.
The details
The platform is fabricated using Tower Semiconductor's PH18DA process, which enables the integration of lasers directly onto the silicon photonic substrate. This approach utilizes InP-based EA modulators—electro-absorption modulators that use semiconductor materials to vary light intensity—to drive 1.6T linear pluggable optics. By integrating 1310nm distributed feedback lasers—devices that emit a single-frequency light signal—into the PIC, the architecture reduces the complexity of external alignment and packaging.
Timeline
September 2026: CIOE 2026 was held in Shenzhen where Openlight announced its modulator enhancements.
The Tech Race
Openlight is working to move beyond traditional discrete optics by integrating active components directly into standard foundry processes. This effort aligns with the industry-wide push to reach 1.6T and 3.2T capacities while meeting the strict Telcordia GR 468 reliability requirements for data center deployment.
This development allows network equipment manufacturers to design more compact and thermally efficient high-speed optical transceivers for data centers. The technology remains in the sampling stage, meaning widespread integration into commercial networking infrastructure will occur in future product cycles.
The takeaway
The industry is shifting toward highly integrated photonic circuits to manage the thermal and power demands of 3.2T networking. Watch for future integration announcements as Openlight moves its 3.2T DR8 platform from the current sampling stage toward full-scale validation.
Further reading
For broader trends in next-generation high-speed connectivity, see our analysis of Semiconductors.
Source note: This article includes information reported by Electronics Weekly.
