Samtec Launched Connector Line for oHFM.c Standard
The new hardware supports high-speed data transmission up to 112 Gbps PAM4 for standardized embedded systems.
Updated on Sept. 29, 2026 in Semiconductors
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Samtec has released a new connector portfolio designed to meet the SGeT oHFM.c standard for embedded computing. These connectors are now available for designers building systems that require high-density interconnects.
Why it matters
The oHFM.c standard provides a unified architectural framework to manage custom form factors and unique pinouts, reducing the engineering time previously required for bespoke designs. By adopting ready-to-use building blocks, developers can accelerate the deployment of high-performance embedded systems.
The new connectors feature a 0.635 mm pitch with options for 5 mm or 10 mm stack heights. They are engineered to sustain 64 Gbps or 112 Gbps PAM4 signaling and utilize IPC Class 3-compliant solder column board termination.
The players
Samtec
A global manufacturer specializing in high-speed interconnect solutions, including board-to-board and high-speed cable systems.
The details
The system relies on Samtec's Edge Rate contact system, which features a smooth milled mating surface to increase durability and cycle life. To maintain signal integrity at high speeds, the narrow edges of the contacts align with the connector body to reduce crosstalk, a common interference issue in dense high-speed arrays.
Timeline
September 29, 2026: Samtec announced the new product portfolio.
The Tech Race
The introduction of this portfolio aligns with the SGeT oHFM.c standard's mission to move the industry away from proprietary, bespoke connector layouts. It creates a competitive baseline for high-speed module interoperability that matches the performance requirements of next-generation embedded processors.
Designers and engineers working on embedded systems can now integrate these standardized components into their upcoming hardware development cycles. The product line is currently released and intended to simplify the integration process for high-bandwidth industrial and computing platforms.
The takeaway
The move toward standardized building blocks like oHFM.c signals a maturation in the embedded module market, focusing on reliability and reduced design cycles. Engineers should look for upcoming system-level benchmarks utilizing this hardware to confirm performance targets in production environments.
Further reading
Explore the latest developments in interconnect architecture at Semiconductors.
More information
Review the full specifications and technical capabilities via Samtec interconnect solutions for oHFM.c.
Source note: This article includes information reported by Microwave Journal.
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