Valens and onsemi Partnered for Automotive Sensor Design
The companies have announced a collaboration to integrate MIPI A-PHY data transmission technology into automotive sensors.
Updated on Sept. 22, 2026 in Semiconductors

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Valens Semiconductor and onsemi have announced a partnership to develop a cost-optimized integrated sensor for 3MP automotive cameras. This announced research-stage collaboration aims to reduce vehicle camera component counts by embedding high-speed data transmission standards directly into image sensors.
Why it matters
The integration aims to simplify complex automotive camera architectures by reducing the number of distinct components required for high-speed data transfer. This effort targets the high-volume 1MP to 3MP sensor market to address rising demand for efficient automotive vision systems.
The partnership utilizes the MIPI A-PHY standard, a long-reach physical layer specification, to carry high-speed data within automotive camera systems. The design aims to consolidate functionality, though specific performance metrics versus discrete component alternatives remain unstated.
The players
Valens Semiconductor
A developer of high-speed connectivity solutions specializing in MIPI A-PHY standards for the automotive and industrial sectors.
onsemi
A semiconductor manufacturer focused on intelligent power and sensing technologies for automotive and industrial applications.
The details
The companies intend to build MIPI A-PHY technology—a standardized interface for high-speed image sensor data—directly into onsemi's sensors. By integrating the transmission interface onto the sensor die, the design eliminates the need for separate bridge chips currently used in vehicle camera modules. This reduction in the bill of materials is intended to lower the complexity and physical footprint of camera systems deployed in passenger vehicles.
Timeline
Q2 2026: Valens reported total revenue of $18.1 million.
Monday, September 21, 2026: VLN stock rose 8% in premarket trading.
2027: Revenue from the automotive design-win programs is expected to begin ramping.
The Tech Race
The collaboration follows the broader industry move toward utilizing the MIPI A-PHY standard to streamline the automotive sensor supply chain. It marks an attempt to accelerate the integration of high-speed transmission directly into silicon, challenging incumbent multi-chip module designs.
Automotive manufacturers stand to benefit from reduced component counts and simplified wiring architectures in camera systems. Consumers will see these technical optimizations when the resulting designs begin production, with revenue ramping expected to start in 2027.
The takeaway
This partnership shifts the industry toward higher integration levels in automotive vision hardware. Market participants should monitor Valens' progress toward its 2027 revenue ramp and its full-year 2026 forecast of $78 million to $81 million for indications of commercial adoption.
Further reading
For more on the latest developments in chip architecture, see Semiconductors.
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