T2M Expanded Automotive Semiconductor IP Portfolio
The supplier has added new IP cores to streamline the development of automotive systems-on-chip.
Updated on Sept. 22, 2026 in Semiconductors
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T2M announced an expansion of its automotive semiconductor intellectual property (IP) portfolio on September 22, 2026. This move consolidates access to multiple connectivity and interface technologies intended to reduce integration risk for developers building automotive systems-on-chip.
Why it matters
The expansion aims to shorten development cycles for complex automotive hardware by providing a unified commercial and technical interface for critical silicon IP. This strategy directly addresses the integration challenges manufacturers face when sourcing disparate components for advanced vehicle systems.
The updated portfolio includes 100BASE-T1 PHY cores supporting 100 Mbps, MIPI A-PHY cores reaching 6.4 Gbps, and DDR/LPDDR combo cores hitting 4800 Mbps. Additionally, T2M now offers high-speed SerDes IP spanning the 10G to 112G performance range.
The players
T2M
A provider of silicon-proven IP cores for automotive applications with global operations across Germany, China, India, South Korea, and the United States.
The details
T2M provides silicon-proven IP cores, which are pre-designed and verified building blocks for integrated circuits, to simplify complex system design. The portfolio includes Automotive Ethernet for vehicle networking, MIPI A-PHY for high-speed video and sensor data, and SerDes—or serializer/deserializer, a pair of functional blocks that convert parallel data to serial for high-speed transmission. Licensing options range from BlackBox and WhiteBox configurations to full IP customization and process-porting services to ensure compatibility with specific semiconductor manufacturing nodes.
Timeline
September 22, 2026: T2M announced the portfolio expansion.
The Tech Race
The expansion places T2M deeper into the competitive market for automotive-grade semiconductor IP, directly supporting the trend toward integrated vehicle compute architectures. This strategy follows industry standards for streamlining the automotive system-on-chip (SoC) development pipeline by minimizing the overhead of disparate component sourcing.
Automotive hardware developers can now source multiple essential interface cores through a single provider, simplifying the supply chain for next-generation vehicle electronics. This shift enables faster prototyping and integration, though the impact on specific end-user vehicle features depends on future hardware implementation cycles.
The takeaway
The move demonstrates the increasing demand for consolidated IP licensing in automotive silicon design. Industry stakeholders should monitor T2M for the release of specific technical benchmarks or updated integration manuals for their 112G SerDes and MIPI A-PHY offerings.
Further reading
For broader trends in component design, see Semiconductors.
Source note: This article includes information reported by Design-reuse.
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