Teledyne e2v Launched Perciva ToF 3D Camera
The new 3D camera uses a proprietary CMOS sensor to deliver real-time depth mapping for industrial environments.
Updated on Sept. 19, 2026 in Semiconductors
Live Poll
Do you believe new automation technology generally improves business operations for your local area?
Teledyne e2v has released the Perciva time-of-flight (ToF) 3D camera, which generates depth maps and point cloud data for use in challenging environments. This product release is now available for deployment in industrial applications.
Why it matters
The development provides a robust sensing solution capable of operating in high-interference zones without requiring multiple linked cameras to maintain performance. It simplifies the integration of 3D vision into automated workflows that require reliable, high-resolution distance data.
The Perciva camera features an 832 x 600-pixel resolution powered by a 10 µm three-tap pixel architecture. Its Hydra3D+ CMOS sensor utilizes HiRho technology to boost the fill-factor quantum efficiency (FFxQE) during near-infrared operations.
The players
Teledyne e2v
A developer of specialized imaging, radio frequency, and semiconductor solutions for medical, industrial, and aerospace applications.
The details
The system produces depth maps and point cloud data by calculating the time light takes to travel to an object and back, a process known as time-of-flight imaging. By integrating the image processing directly into the camera, the unit transmits actionable 3D data over a GigE (Gigabit Ethernet) interface. The architecture is designed to manage interference autonomously, allowing individual cameras to operate in dense environments without the need for additional synchronization.
Timeline
September 19, 2026: Teledyne e2v announced the release of the Perciva ToF camera.
The Tech Race
This release follows the ongoing industry push to transition high-performance image sensors from raw modules into integrated, plug-and-play vision systems. By basing the device on the Hydra3D+ CMOS image sensor, the company moves to capture market share in industrial sectors currently hindered by the overhead of complex, multi-camera synchronization.
Industrial automation engineers can now implement 3D vision systems with lower integration complexity due to the embedded calibration and processing features. Users should verify that their existing GigE network infrastructure can handle the high-resolution depth and point cloud data throughput.
The takeaway
The move suggests a shifting focus toward hardware that offloads intensive point cloud calculations from central controllers to the edge sensor. Potential buyers should monitor industry trade shows for demonstrations of the sensor performance in real-world high-interference industrial test beds.
Further reading
For broader trends in sensor-level computing and signal processing, visit our Semiconductors section.
Live Poll
Do you believe new automation technology generally improves business operations for your local area?
