SUNON Will Exhibit Liquid Cooling at 2026 OCP Summit
The manufacturer will showcase its data center thermal management portfolio in San Jose this October.
Updated on Sept. 29, 2026 in Data Centers
Live Poll
Will advancements in liquid cooling effectively manage the increasing heat generated by modern AI data centers?
SUNON will display its range of liquid cooling solutions at the 2026 OCP Global Summit, held from October 12-15, 2026, at the San Jose McEnery Convention Center. The company is set to demonstrate cooling technologies designed for chip, server, and rack-level applications.
Why it matters
As chip power densities continue to increase, effective thermal management has become a critical operational requirement for modern data centers. This exhibition highlights current industry efforts to address these escalating cooling challenges through specialized hardware.
SUNON will showcase cooling products categorized by chip, server, and rack-level implementations at booth A19. The specific capacity ratings of these units compared to existing standards remain to be detailed.
The players
SUNON
A manufacturer specializing in thermal management hardware, including fans and liquid cooling solutions for data centers.
The details
SUNON designs thermal management products to mitigate heat in dense computing environments. The company will display systems categorized by three physical tiers: chip-level, server-level, and rack-level cooling. These systems move heat away from high-density components to maintain operational stability as chip power requirements grow.
Timeline
The 2026 OCP Global Summit will take place from October 12-15, 2026.
The Tech Race
This presentation aligns with the broader industry drive toward standardized thermal management showcased at the OCP Global Summit. It reflects the ongoing competitive focus on addressing rising chip power densities in large-scale data center infrastructure.
Data center operators and engineers attending the summit can inspect these cooling systems firsthand at booth A19. The presentation provides a chance to evaluate how these specific hardware tiers integrate into existing high-density server configurations.
The takeaway
As server densities rise, manufacturers are prioritizing liquid cooling as a standard solution for managing thermal loads. Attendees can monitor the OCP Global Summit schedule for specific technical presentations from the vendor.
Further reading
For more on evolving infrastructure requirements, visit Data Centers.
Live Poll
Will advancements in liquid cooling effectively manage the increasing heat generated by modern AI data centers?
