Hanmi Semiconductor Won $5.8 Million Equipment Order
The manufacturer will supply precision semiconductor assembly tools to UTAC Thailand by the end of 2026.
Updated on Sept. 29, 2026 in Semiconductors
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Hanmi Semiconductor has secured a $5.8 million order for specialized assembly equipment from UTAC Thailand. This agreement for micro SAW & VISION PLACEMENT systems is scheduled for completion by December 28, 2026.
Why it matters
This contract represents 1.37 percent of Hanmi Semiconductor’s 2025 consolidated revenue and strengthens the supply relationship between the firms. It reflects a continued industrial reliance on automated precision processing tools for semiconductor manufacturing.
The contract covers micro SAW & VISION PLACEMENT equipment, which automates the cutting, cleaning, drying, inspection, sorting, and loading of semiconductor packages. This order follows a prior supply agreement valued at 1.56 billion won from May 2022.
The players
Hanmi Semiconductor
A manufacturer of semiconductor assembly equipment focused on wafer cutting, sorting, and precision placement tools.
UTAC Thailand
A branch of the Singapore-headquartered United Test and Assembly Center, providing semiconductor testing and assembly services.
The details
The equipment integrates multiple stages of the post-fabrication process, specifically dicing silicon wafers into individual chips and managing their inspection and placement. This consolidated system automates what were previously discrete manual or semi-automated steps, improving efficiency in semiconductor back-end production environments. The system handles cleaning and drying post-cut to ensure packaging integrity before final sorting.
Timeline
May 2022: Hanmi Semiconductor supplied initial equipment to UTAC Thailand.
2025: Reference period for consolidated revenue reporting.
December 28, 2026: The final date for contract fulfillment.
The Tech Race
This deal underscores the ongoing demand for sophisticated micro-dicing and vision inspection systems in semiconductor assembly. It aligns with the industry-wide shift toward highly integrated, automated packaging workflows.
This machinery upgrade primarily affects the production capacity of the UTAC manufacturing facility in Thailand. It indicates a move toward higher throughput for the assembly of integrated circuits that eventually power consumer and industrial electronics.
The takeaway
This order highlights the consistent demand for integrated, automated back-end manufacturing systems in the semiconductor supply chain. Readers should track upcoming quarterly financial reports from Hanmi Semiconductor for updates on fulfillment progress or expanded contracts.
What happens next
The contract is scheduled to be completed by December 28, 2026.
Further reading
For more on the latest factory-floor technologies, visit Semiconductors.
Source note: This article includes information reported by Pulse.
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