Onsemi Developed Silicon Wafer Power Platform
The platform integrates power components directly into 12-inch silicon wafers to optimize efficiency for electric vehicles.
Updated on Sept. 21, 2026 in Semiconductors
Live Poll
Do you believe new semiconductor technologies will make electric vehicles more affordable for your household?
Onsemi has introduced an Embedded Power Platform that replaces traditional printed circuit board substrates with 12-inch silicon wafers. Subaru has signed on as an early partner to utilize this technology for future electric vehicle production.
Why it matters
This approach targets efficiency losses, thermal constraints, and complexity in power systems by integrating components into a single substrate. The integration enables more compact and cooler power modules, which is critical for scaling high-performance electric vehicles.
The platform achieves up to 5x power density gains by embedding power semiconductors, drivers, and controllers directly into a silicon wafer. This results in a 20% reduction in operating temperatures for solid-state circuit breakers compared to standard PCB-mounted designs.
The players
Onsemi
A semiconductor manufacturer focused on power and sensing technologies for automotive and industrial markets.
Subaru
An automotive manufacturer currently expanding its electric vehicle production capabilities.
The details
The technology departs from standard electronics manufacturing by embedding power systems within a package substrate rather than mounting modules on a printed circuit board. By placing components directly within a 12-inch silicon wafer, the platform allows for the co-optimization of electrical, thermal, and mechanical performance. It integrates silicon, silicon carbide, and gallium nitride — a high-efficiency semiconductor material — to manage power flow more effectively than traditional discrete components.
Timeline
2026: Onsemi expects to scale sampling to wider customer groups and add additional partners.
The Tech Race
This move represents a fundamental shift in how power electronics are packaged, moving away from board-level assembly to integrated wafer-level systems. It competes with traditional semiconductor packaging roadmaps that focus on improving thermal management through specialized board materials rather than substrate elimination.
Electric vehicles using this platform will see immediate gains in energy efficiency and reduced cooling requirements. Subaru is currently receiving engineering models, but wider availability for consumer-facing vehicle production remains scheduled for 2026.
The takeaway
This technology streamlines power system integration by eliminating the printed circuit board as a bottleneck. Watch for the 2026 product cycle to see if other automotive manufacturers adopt this substrate-integrated approach.
Further reading
For more on how new materials and packaging designs are reshaping performance, visit Semiconductors.
Source note: This article includes information reported by Wccftech.
Live Poll
Do you believe new semiconductor technologies will make electric vehicles more affordable for your household?
